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Manufacturer reference design

适用于超值系列 MCU 的 MSP430™ LaunchPad™ 开发套件

BOM000338 · V1.1

What the project is · as the catalogue files it; the circuit functions below are BOM rule hits

Filed under “TI” in the ezPLM catalogue.

Circuit functions included · BOM rule hits · not reviewed

Helper circuits
The board in 适用于超值系列 MCU 的 MSP430™ LaunchPad™ 开发套件 seen from the top (bottom copper dimmed), drawn from its parsed design files
PCB · seen from the top
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The schematic sheet of 适用于超值系列 MCU 的 MSP430™ LaunchPad™ 开发套件 placing the most parts, drawn from its parsed design files
Schematic
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101 rows · 182 parts0 of 101 rows placedHover or click a row to mark its parts in the view; click a part in the view to find its row.

Looks up part numbers and makers at ezPLM, DigiKey and Mouser. What it finds are suggestions: check one before you use it.

DesignatorsValuePartQty
ZZ5Place the shunts for RGB-LEDs (SH-J8-1, SH-8-2 and SH-J8-3) only on the right pins of J8AssemblyNote
Place the shunts for RGB-LEDs (SH-J8-1, SH-8-2 and SH-J8-3) only on the right pins of J8
1
R1, R2, R118, R1194.7k0402
4.7k
4
XU1110-44-320-41-001000Mill-Max_110-xx-320-41-001000
110-44-320-41-001000
1
FID1, FID2, FID3FiducialFiducial6.4-20
Fiducial
3
R4, R101, R1033900402
390
3
U104MSP430G2452IRSA16RRSA0016B
MSP430G2452IRSA16R
1
MH1, MH2, MH3, MH4MTG_NoPadsNPTH125mil
MTG_NoPads
4
R130150k0402
150k
1
C106, C107, C119, C123, C12410pF0402
10pF
5
R1151.40k0402
1.40k
1
D102150060YS75000WL-SMCW_YELLOW
150060YS75000
1
R8, R100, R1204700402
470
3
J3SSQ-102-03-F-SBoosterPack_20pin_J3
SSQ-102-03-F-S
1
C1324.7uF0603
4.7uF
1
ZZ3These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.AssemblyNote
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
1
Q101BC850CW,115SOT-323
BC850CW,115
1
C111, C1304.7uF3216-18
4.7uF
2
R113, R114270402
27
2
SH-J101-6Place J101: 11-12SNT-100-BK-G
Place J101: 11-12
1
D2, D100150060RS75000WL-SMCW_RED
150060RS75000
2
SH-J101-1Place J101: 1-2SNT-100-BK-G
Place J101: 1-2
1
R1332.20k0402
2.20k
1
C108, C110, C1250.22uF0402
0.22uF
3
C121000pF0603
1000pF
1
R1218200402
820
1
Logo3FCC disclaimerFCC_disclaimer
FCC disclaimer
1
R3, R5, R7, R900603
0
4
R12400402
0
1
D104, D105BAS40-05,215SOT-23
BAS40-05,215
2
C10, C1112pF0402
12pF
2
U100MSP430F5528IRGCTRGC0064B
MSP430F5528IRGCT
1
J8TSW-103-07-G-DTSW-103-07-G-D
TSW-103-07-G-D
1
C13, C14, C117, C1201000pF0402
1000pF
4
C134, C135, C136, C137, C138, C13933pF0402
33pF
6
C3, C100, C104, C112, C1401uF0402
1uF
5
R110, R11201206
0
2
SH-J101-7Place J101: 13-14SNT-100-BK-G
Place J101: 13-14
1
R125, R129220k0402
220k
2
ZZ7Place the MSP1 device in the XU1 socket, with the pin 1 indicators lined upAssemblyNote
Place the MSP1 device in the XU1 socket, with the pin 1 indicators lined up
1
J4PEC03SAANPEC03SAAN_Launchpad_3V3
PEC03SAAN
1
S1, S21188E-1K2-V-TRSW_1188E
1188E-1K2-V-TR
2
C7, C9, C102, C1420.01uF0402
0.01uF
4
C210uF3216-18
10uF
1
L100, L101150 ohm0603
150 ohm
2
R1343.30k0402
3.30k
1
R127, R128, R131, R132220k0603
220k
4
R1020.20603
0.2
1
C1090.47uF0402
0.47uF
1
J5PEC03SAANPEC03SAAN_Launchpad_5V0
PEC03SAAN
1
D319-337/R6GHBHC-A01/2T19-337_RGB
19-337/R6GHBHC-A01/2T
1
ESD, Logo1ESD SusceptibleESD_Overlay_Medium
ESD Susceptible
1
J2SSQ-110-03-F-SBoosterPack_20pin_J2
SSQ-110-03-F-S
1
C121, C1284.7uF0805_HV
4.7uF
2
C6, C8, C1272.2uF3216-18
2.2uF
3
ZZ2These assemblies are ESD sensitive, ESD precautions shall be observed.AssemblyNote
These assemblies are ESD sensitive, ESD precautions shall be observed.
1
Y100CSTCR4M00G15L99-R0Murata_CSTCR
CSTCR4M00G15L99-R0
1
Logo1, RoHSPb-Free SymbolPb-Free_Overlay_Medium
Pb-Free Symbol
1
U105TPS22968NDPURDPU0014A
TPS22968NDPUR
1
R1376.81k0402
6.81k
1
R104, R105, R106, R107, R109, R11110.00402
10.0
6
Q100DMG1013UW-7SOT-323
DMG1013UW-7
1
C1154.7uF0402
4.7uF
1
ZZ4These assemblies must comply with workmanship standards IPC-A-610 Class 2, unless otherwise specified.AssemblyNote
These assemblies must comply with workmanship standards IPC-A-610 Class 2, unless otherwise specified.
1
SH-J8-1Place on Pin 2 onlySNT-100-BK-G
Place on Pin 2 only
1
L1022.2uHCBC2518
2.2uH
1
R647.0k0603
47.0k
1
Logo1Texas InstrumentsTI_Symbol_Overlay_Medium
Texas Instruments
1
R11240402
24
1
ZZ6Place a click-in Standoff (MAE-10, KangYang) in hole MH1/MH2. Parameters for Standoffs were manually adapted for BOM generation.AssemblyNote
Place a click-in Standoff (MAE-10, KangYang) in hole MH1/MH2. Parameters for Standoffs were manually adapted for BOM generation.
1
C1032.2uF0402
2.2uF
1
J101PEC07DAANPEC07DAAN_Launchpad_EZ-FET
PEC07DAAN
1
SH-J8-2Place on Pin 4 onlySNT-100-BK-G
Place on Pin 4 only
1
SH-J101-4Place J101: 7-8SNT-100-BK-G
Place J101: 7-8
1
U102INA214AIDCKRDCK0006A_N
INA214AIDCKR
1
U103TPD2E001DRLRDRL0005A
TPD2E001DRLR
1
R11733k0402
33k
1
1, Logo, TITexas InstrumentsTI_Horizontal_Overlay_Medium
Texas Instruments
1
J1SSQ-110-03-F-SBoosterPack_20pin_J1
SSQ-110-03-F-S
1
H1, H2MAE-10KY_MAE-10
MAE-10
2
R10, R108, R135, R13647k0402
47k
4
Y1ECS-.327-12.5-34B-TRECS_ECX_31B
ECS-.327-12.5-34B-TR
1
J100TC2050-IDC-NL-FPTag_TC2050-NL
TC2050-IDC-NL-FP
1
R121100402
110
1
R126240k0402
240k
1
J6, J7TSW-102-07-G-STSW-102-07-G-S
TSW-102-07-G-S
2
R1221.00Meg0402
1.00Meg
1
D1, D101150060VS75000WL-SMCW_GREEN
150060VS75000
2
SH-J6Place J6: 1-2SNT-100-BK-G
Place J6: 1-2
1
SH-J8-3Place on Pin 6 onlySNT-100-BK-G
Place on Pin 6 only
1
J1021051640001Molex_1051640001
1051640001
1
SH-J7Place J7: 1-2SNT-100-BK-G
Place J7: 1-2
1
U101TPS73533DRVRDRV0006A
TPS73533DRVR
1
SH-J101-2Place J101: 3-4SNT-100-BK-G
Place J101: 3-4
1
D103B0530W-7-FSOD-123
B0530W-7-F
1
R1161.0Meg0402
1.0Meg
1
C1, C4, C5, C101, C105, C113, C114, C116, C118, C122, C126, C129, C131, C133, C1410.1uF0402
0.1uF
15
SH-J101-3Place J101: 5-6SNT-100-BK-G
Place J101: 5-6
1
CE, LOGO1CE MarkCE_Mark_5mm
CE Mark
1
SH-J101-5Place J101: 9-10SNT-100-BK-G
Place J101: 9-10
1
R1230.0470603
0.047
1
R13160402
16
1
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